Kamfanin na Amurka Qualcomm an san shi da farko a matsayin mai kera kwakwalwan wayar hannu, amma iyakarsa ya fi fadi - yana kuma “yin” firikwensin yatsa, alal misali. Kuma ta gabatar da wani sabo a CES 2021 mai gudana. Daidai, shine ƙarni na biyu na 3D Sonic Sensor sub-display reader, wanda ya kamata ya zama 50% sauri fiye da firikwensin ƙarni na farko.
Sabuwar ƙarni na 3D Sonic Sensor shine 77% girma fiye da wanda ya riga shi - ya mamaye yanki na 64 mm2 (8×8 mm) kuma baƙar fata ce kawai 0,2 mm, don haka zai yiwu a haɗa shi ko da a cikin sassauƙan nunin wayoyi masu nadawa. Dangane da Qualcomm, girman girman zai ba mai karatu damar tattara ƙarin bayanan biometric sau 1,7, saboda za a sami ƙarin sarari don yatsan mai amfani. Kamfanin ya kuma yi iƙirarin cewa na'urar firikwensin yana iya sarrafa bayanai da sauri 50% fiye da tsohuwar, don haka ya kamata ya buɗe wayar cikin sauri.
3D Sonic Sensor Gen 2 yana amfani da duban dan tayi don gane baya da pores na yatsa don ƙarin aminci. Koyaya, sabon sigar har yanzu yana da ƙarancin firikwensin 3D Sonic Max, wanda ke rufe yanki na 600mm.2 kuma yana iya tabbatar da yatsu biyu lokaci guda.
Qualcomm yana tsammanin sabon firikwensin zai fara bayyana a cikin wayoyi a farkon wannan shekara. Kuma idan aka yi la'akari da cewa Samsung ya riga ya yi amfani da ƙarni na ƙarshe na mai karatu, ba a cire cewa sabon zai riga ya bayyana a cikin wayoyin hannu na jerin flagship na gaba. Galaxy S21 (S30). Za a gabatar da shi a wannan makon ranar Alhamis.
Kuna iya sha'awar
