An auna aikin guntu flagship mai zuwa na Qualcomm, Snapdragon 875, a cikin wani ma'auni, inda ya sami damar doke sabon chipset na Huawei, Kirin 9000. Musamman, Snapdragon 875 ya sami maki 899 a cikin babban ma'aunin Master Lu. doke Kirin 401 da kusan 9000% (da kuma guntu na yanzu Qualcomm Snapdragon 3 ta 865%).
Ya kamata a lura a nan cewa Snapdragon 875 da aka gwada samfurin injiniya ne (watau ba na'urar tallace-tallace ba), don haka sakamakon aikin na iya bambanta, sama da ƙasa.
A cikin gwajin processor na Snapdragon 875, ya sami maki 333, inda ya doke Kirin 269 da kashi 9000% kuma wanda ya gabace shi da kashi 17%. Koyaya, Kirin 13 ya nuna ƙarfinsa a gwajin guntu, inda ya sami maki 9000, inda ya doke Snapdragon 344 da kusan kashi ɗaya cikin ɗari da Snapdragon 334 da kusan 875%. ainihin sigar Mali-G14,5 GPU, yayin da Snapdragon 865 Adreno 9000 guntu bisa ga bayanan da ba na hukuma ba.
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Kuna iya sha'awar
Har ila yau yana da kyau a kara da cewa na'urorin da aka gwada kwakwalwar kwakwalwar suna dauke da 12 GB na RAM, kuma wayar Huawei Mate 40 Pro mai sabuwar Kirin tana da wata fa'ida ta saurin adanawa.
Yana da ban sha'awa a ambaci cewa Snapdragon 875 gabaɗaya ya fi Kirin 9000 ƙarfi duk da cewa babban kayan aikin sa yana gudana a mitar 2,84 GHz (kamar a cikin Snapdragon 865), yayin da "babban" core na Kirin 9000 ke rufe. da 3,13 GHz.
A baya an auna aikin Snapdragon 875 a cikin sanannen alamar AnTuTu, inda guntu ya sami maki kusan 848 kuma a zahiri ya tattake wayar mafi sauri tare da bambance-bambancen "da" na Snapdragon 000 ROG Phone 865, wanda ya kai kusan maki 3.
